Published Papers, Presentations
H. Ikeda, S. Sekine, et. al. “Fine Pitch Micro-Bump Forming by Printing”
Proc. 2016 International Conference on Electronics Packaging (ICEP 2016), #TD2-4, pp260-264, Apr. 2016. (4/21) Sapporo.
H. Ikeda, S. Sekine, et. al. “3DIC/TSV Process Developments by Printing Technologies”, Proc. IEEE CPMT Symposium Japan (ICSJ 2015), pp140-143, Nov. 2015. (11/10) Kyoto.
H. Ikeda, S. Sekine, et. al. “Nano-Function Materials for TSV Technologies”
Proc. 2015 International 3D Systems Integration Conference (3DIC 2015), #TS5.3.1, pp. 89-94, Sep. 2015. Sendai.
H. Ikeda, S. Sekine, et. al. “Nano-Function Paste for Power Semiconductors”
Proc. 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC 2015), #TE3-1, pp. 482-485, Apr. 2015. (4/16) Kyoto.
Fengqun Lang, Fumiki Kato, Hiroshi Nakagawa, Hirosi Yamaguchi, Hiroshi Sato (FUPET) Keiji Okada, Ryuji Kimura, Hiroaki Shindo, Shigenobu Sekine (Napra)
“Bond of Al Electrode Side of SiC Power Devices Using Transient Liquid Phase Sintering (TLPS)-Cu+Ag/Sn+Cu・Nanocomposite Powder Paste”
21st Symposium on “Microjoining and Assembly Technology in Electronics”
February, 2015
H. Ikeda (Napra,Kobe Univ.), S. Sekine(Napra), M. Nagata(Kobe Univ.), et. .al., “Nano-Function Paste for Power Semiconductors”,
ICEP2015 Proceeding pp482-485, Apr. 2015
Fengqun Lang, Fumiki Kato, Hiroshi Nakagawa, Hirosi Yamaguchi, Hiroshi Sato (FUPET) Ryuji Kimura, Hiroaki Shindo, Shigenobu Sekine (Napra)
“Formation of Cu3Sn using Transient Liquid Phase Sintering (TLPS) with Ag-Coated Cu + Sn-Cu・Nanocomposite Powder Paste for Integration of SiC Power Devices” 1st Meeting on Advanced Power Semiconductors, The Japan Society of Applied Physics Advanced Power Semiconductors Division, November, 2014
Fengqun Lang, Fumiki Kato, Hiroshi Nakagawa, Hirosi Yamaguchi, Hiroshi Sato (FUPET) Ryuji Kimura, Shindo, Shigenobu Sekine (Napra)
“Bond of Al Electrode Side of SiC Power Devices Using Transient Liquid Phase Sintering(TLPS)-Cu+Ag/Sn+Cu・Nanocomposite Powder Paste”
22nd Meeting on SiC and Related Semiconductors, December 9th, 2013
“New Interconnection Alloy Metal for High Bonding Strength -Nano Composite Particles synthesized by nanomized method” Sekine,S,Kimura,R, Okada,K, Shindo,H, Ooi,T(Napra), Itoh,U, Yoshida,M, Tokuhisa,H(AIST), Proceedings of Electronics Packaging (ICEP), 2014 International Conference p.152 – 155, Apr. 2014
Workfunction mapping of interface between crystalline Si and metal paste electrode using KFM , Yamada,F (Toyota Technological Institute), Yoshida, M(AIST), Aoki ,M(Toyota Technological Institute), Tokuhisa,H, Itoh,U (AIST), Sumida,I (Sumida Consulting), Sekine,S (Napra), Kamiya,I and Ohshita, Y (Toyota Technological Institute)、28th EU PVSEC、Oct., 2013
DEVELOPMENT OF CU PASTES CONTAINING A LOW MELTING POINT ALLOY FOR LOW TEMPERATURE SINTERING ,Tokuhisa,H, Yoshida,M, Morita,S, ItohU,(AIST), Sumida,I (Sumida Consulting), Sekine,S (Napra) and Kamata,T (AIST), 27th EU PVSEC, Oct., 2012
Recent progress on Cu pastes for silicon solar cells , Tokuhisa,H. Yoshida,M, Morita,S, Itoh,U (AIST), Sumida,I(Sumida Consulting), Sekine,S(Napra) and Kamata,T (AIST), 22nd Workshop on Crystalline Silicon Solar Cells & Modules: Materials and Processes, July., 2012
Novel Low-Temperature-Sintering Type Cu-Alloy Pastes for Silicon Solar Cells , Yoshida,M,,Tokuhisa,H, Itoh,U (Printed Electronics Device team), Sumida,I(Sumida Consulting),Sekine,S (Napra) and Kamata,T (AIST), Energy Procedia, vol.21 pp.66-74, June., 2012
Cu ALLOY PASTES CONTAINING LOW MELTING POINT (LMP) ALLOYS FOR SILICON SOLAR CELLS RECQUIRING LOW TEMPERATURE SINTERING , Tokuhisa,H, Yoshida,M, Morita,S, Itoh,U (AIST), Kamata,T (AIST), Sumida,I (Sumida Consulting) and Sekine,S (Napra), Technical Digest, PVSEC-21, Nov., 2011
Grass-fritless Cu alloy pastes for silicon solar cells recquiring low temperature sintering “, Yoshida,M,Tokuhisa,H, Itoh,U (AIST), Sumida,I (Sumida Consulting), Sekine,S (Napra) and Kamata,T (AIST),26th EUPVSEC, Nov.,2011
GLASS-FRITLESS CU ALLOY PASTES FOR SILICON SOLAR CELLS RECQUIRING LOW TEMPERATURE SINTERING, Tokuhisa,H, Yoshida,M, Itoh,U (AIST), KamataT (AIST), Sumida,I (Sumida Consulting) and Sekine ,S(Napra), 37th IEEE PVSC, June 2011
Study on TSV with new filling method and alloy for advanced 3D-SiP，Tsukada, A. Sato, R, Sekine, S. Kimura, R. Kishi, K. Sato, Y. Iwata, Y. Murata, H.，Proceedings of IEEE 61th Electrical Components and Technology Conference，p.1981-1986，June.2011