Awards

2024
Winner of the ICEP First Place Award

2012
A prize by Commissioner of Japan Patent Office
Excellent Company utilising Intellectual Property Rights

Books、Magazine, Newspaper

2019
The Sankei Shimbun May 23 morning edition
Semiconductor, 2019 of the Year semiconduction substantives and inflectionals electron materials section excellence prizes

2016
Nikkei　, September,9,2016
“Advanced Heat-Resistive Die Attach Material”

2015
Nikkei Electronics (Nikkei PB), October, 2015
“Replacing plating by printing to fill TSV for low cost 3D IC”
Nikkei Electronics (Nikkei PB), October, 2015
“Heat tolerance devices achievable 200℃ for automotive”

2013
Japan Patent Office Annual Report (FY2013, pp195)
“Small and Medium sized companies ustilizing Intellectual Properties; Napra Co., Ltd.”

2009
Nikkei Microdevices (Nikkei BP), December, 2009
“New technology development which fills 0.5um diameter via to be TSV by 5 minutes”

2014
Nikkei Electronics (Nikkei PB), September 15th, 2014
“Napra (material supplier) developed Cu-based high-temperature-resistive joint material which extracting SiC’s latent potential”